Teonex ® PEN Film

Teonex ® PEN Film For Electrical Insulation

    Teonex ® Pen Film is DuPont's biaxially oriented polyethylene naphthalate (PEN) film. This new product range has been developed specifically to meet your needs for cost effective films with performance between that of polyethylene terephthalate (PET) and polyamide.

    Teonex ® Q51 Pen Film and P. Leo Pen Tape can be applied as major insulation in Class F, H and N Electrical Insulation System.

    Teonex ® Pen Film is a Class H material with the following key features:

    The benefits of using Teonex ® Pen Film are:

    Teonex ® Pen Film For Flexible Printed Circuitry


    The evolution of Flexible Printed Circuitry (FPC) technology has been highly dependent on the availability of suitable base dielectric films. Innovative packaging techniques comprising fine line geometries, high densities, and maximum functionality coupled with high reliability are driving the need for new dielectric materials.

    Teonex ® Pen Film is DuPont's biaxially oriented polyethylene naphihalate (PEN) film. It offers unique mechanical properties with enhanced environmental resistance characteristics that fulfill these demanding criteria.

    Flexible Printed Circuitry

    Since its inception, FPC usage has exhibited a steady growth pattern based primarily on the following

    For years, in fact, FPC's have been used in behind-the-dash automotive electronic applications due to these inherent characteristics.

    Two types of film have been dominate substrates of choice for FPC applications - polyethylene terephthalate (PET) and polyimide. PET films, the least expensive, have proven adequate for applications where the circuit is exposed to non-hostile environmental conditions. Polyimide film, however has emerged as the substrate of choice in critical FPC applications where resistance to heat and chemical exposure and dimensional stability are key requirements. The economics in transitioning from PET film to polyimide film, however, leave much to be desired. Hence, the development of Teonex ® PEN Film films.

    Teonex ® PEN Film films exhibit a glass transition temperature (Tg) of 120 degree centigrade, 42 degree centigrade higher than that of PET films. This characteristic in addition to its excellent dimensional stability, chemical resistance, and mechanical properties position Teonex ® PEN Film film as an ideal alternative to both PET and polyimide films. It surpasses PET films in top end demanding applications and replaces polyimide films where Teonex ® Pen Film performance characteristics and cost can result in considerable savings to the FPC manufacturer.


    As is clearly evident, Teonex ® PEN Film films represents a significant breakthrough in dielectric film technology for Flexible Printed Circuitry. The distinct advantages of Teonex ® PEN Film films combine to meet the special demands imposed on the dielectric substrate during each production stage and ultimate end use.

    The following schematic identifies the different properties where Teonex ® PEN Film is superior to polyester film.

    [ Technical Data ]

    Because the DuPont Company cannot anticipate or control the many different conditions under which this information and/or product may be used, it does not guarantee the applicability or the accuracy of this information or the suitability of its products in any given situation. Users of DuPont products should make their own tests to determine the suitability of each such product for their particular purposes. The data listed herein falls within the normal range of product properties but they should not be used to establish specification limits or used alone as the basis of design.

    Disclosure of this information is not a license to operate or a recommendation to infringe a patent of DuPont or others.

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